Impact of different bonding methods on high voltage cable shield induced voltage and current in normal and fault conditions
- authored by
- Mahdi Mahdipour, Asghar Akbari Azirani, Mohammad Khalilzadeh, Peter Werle
- Abstract
Six different bonding methods are discussed briefly. In order to find methods with least induced voltage and current, EMTP software is used to investigate the effect of these configurations on shield induced voltage and current. Normal and core to shield short circuit conditions, and surge over-voltage (lightning) are considered in simulations. Finally appropriate bonding methods for different conditions are proposed.
- Organisation(s)
-
High Voltage Engineering and Asset Management Section (Schering Institute)
- External Organisation(s)
-
K.N. Toosi University of Technology (KNTU)
University of Tehran
- Type
- Conference contribution
- Pages
- 1308-1312
- No. of pages
- 5
- Publication date
- 19.07.2017
- Publication status
- Published
- Peer reviewed
- Yes
- ASJC Scopus subject areas
- Electrical and Electronic Engineering, Control and Optimization, Energy Engineering and Power Technology
- Electronic version(s)
-
https://doi.org/10.1109/IranianCEE.2017.7985244 (Access:
Closed)
