Impact of different bonding methods on high voltage cable shield induced voltage and current in normal and fault conditions
- verfasst von
- Mahdi Mahdipour, Asghar Akbari Azirani, Mohammad Khalilzadeh, Peter Werle
- Abstract
Six different bonding methods are discussed briefly. In order to find methods with least induced voltage and current, EMTP software is used to investigate the effect of these configurations on shield induced voltage and current. Normal and core to shield short circuit conditions, and surge over-voltage (lightning) are considered in simulations. Finally appropriate bonding methods for different conditions are proposed.
- Organisationseinheit(en)
-
Fachgebiet Hochspannungstechnik und Asset Management (Schering-Institut)
- Externe Organisation(en)
-
K.N. Toosi University of Technology (KNTU)
University of Tehran
- Typ
- Aufsatz in Konferenzband
- Seiten
- 1308-1312
- Anzahl der Seiten
- 5
- Publikationsdatum
- 19.07.2017
- Publikationsstatus
- Veröffentlicht
- Peer-reviewed
- Ja
- ASJC Scopus Sachgebiete
- Elektrotechnik und Elektronik, Steuerung und Optimierung, Energieanlagenbau und Kraftwerkstechnik
- Elektronische Version(en)
-
https://doi.org/10.1109/IranianCEE.2017.7985244 (Zugang:
Geschlossen)
